Categories
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SMT Part 1: SMT Components and Process Steps
Price Varies
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SMT Part 2: Advanced Packaging & SMT Implementation
Price Varies
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SMT Part 3: Design for Manufacturing: Lead Free Only
Price Varies
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SMT Part 5: Adhesive & Paste Application
Price Varies
Specs
This course can help you establish a strong internal infrastructure in DFM for SMT, fine pitch BGA and BTC using both tin lead and lead free components. You will get a good understanding of root causes of major defects in SMT and through hole tin-lead and Lead Free assemblies and ways to prevent them. After completing this eight part video course you will be able to:
- Get an in-depth understanding SMT, tin-lead and LF BGA, CSP and emerging technologies such as BTCs (QFN, MLF)
- Troubleshoot BGA, fine pitch and BTC problems in manufacturing
- Determine best way to deal with backward and forward compatibility situations (Lead Free and tin-lead components on the same board).
- Understand metallurgy of lead free solder to enable selection of appropriate lead free solder alloys, soldering and rework processes and equipment.
- Understand details of application specific soldering such as low temperature alloy soldering, mixed alloy soldering, selective and laser soldering
- Understand factors in selecting appropriate components and PCB laminates and how lead free affects your choices for components, laminates and surface finishes
- Ensure your boards are designed for manufacturability and yield
- Troubleshoot SMT, BGA, BTC and fine pitch problems in manufacturing for both tin lead and lead free.
- Use the knowledge gained in this course to develop and or improve your internal DFM and Process documents.